LT1763 Series
PACKAGE DESCRIPTION
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)
0.40 p 0.10
4.00 p0.10
(2 SIDES)
R = 0.115
TYP
7
12
0.70 p0.05
R = 0.05
TYP
3.30 p0.05
3.60 p0.05
3.30 p0.10
3.00 p0.10
(2 SIDES)
2.20 p0.05
PIN 1
TOP MARK
(NOTE 6)
1.70 p 0.05
1.70 p 0.10
PIN 1 NOTCH
R = 0.20 OR
PACKAGE
OUTLINE
0.35 s 45o
CHAMFER
(UE12/DE12) DFN 0806 REV D
6
1
0.25 p 0.05
0.75 p0.05
0.25 p 0.05
0.200 REF
0.50 BSC
0.50 BSC
2.50 REF
2.50 REF
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.189 – .197
(4.801 – 5.004)
NOTE 3
.045 .005
.160 .005
.050 BSC
7
5
8
6
.053 – .069
(1.346 – 1.752)
.004 – .010
(0.101 – 0.254)
.245
MIN
.150 – .157
(3.810 – 3.988)
NOTE 3
.228 – .244
(5.791 – 6.197)
.050
(1.270)
BSC
.014 – .019
(0.355 – 0.483)
TYP
.010 – .020
(0.254 – 0.508)
.030 .005
TYP
s 45°
1
3
4
2
RECOMMENDED SOLDER PAD LAYOUT
.008 – .010
(0.203 – 0.254)
0°– 8° TYP
NOTE:
INCHES
(MILLIMETERS)
1. DIMENSIONS IN
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
.016 – .050
2. DRAWING NOT TO SCALE
(0.406 – 1.270)
SO8 0303
1763fe
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
19
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