LT6300
ELECTRICAL CHARACTERISTICS
The
q
denotes the specifications which apply over the full specified temperature range, otherwise specifications are at T
A
= 25°C.
V
CM
= 0V, pulse tested,
±5V ≤
V
S
≤ ±12V,
V
SHDNREF
= 0V, R
BIAS
= 24.9k between V
+
and SHDN unless otherwise noted. (Note 3)
SYMBOL
A
VOL
PARAMETER
Large-Signal Voltage Gain
CONDITIONS
V
S
=
±12V,
V
OUT
=
±10V,
R
L
= 40Ω
q
MIN
63
57
60
54
10.7
10.5
10.4
10.2
3.5
3.3
3.4
3.2
500
q
TYP
76
70
10.9
10.7
3.8
3.7
1200
10
8
6
4
MAX
UNITS
dB
dB
dB
dB
±V
±V
±V
±V
±V
±V
±V
±V
mA
V
S
=
±5V,
V
OUT
=
±3V,
R
L
= 25Ω
q
V
OUT
Output Swing
V
S
=
±12V,
R
L
= 100Ω
q
V
S
=
±12V,
I
L
= 250mA
q
V
S
=
±5V,
R
L
= 25Ω
q
V
S
=
±5V,
I
L
= 250mA
q
I
OUT
I
S
Maximum Output Current
Supply Current per Amplifier
V
S
=
±12V,
R
L
= 1Ω
V
S
=
±12V,
R
BIAS
= 24.9k (Note 6)
V
S
=
±12V,
R
BIAS
= 32.4k (Note 6)
V
S
=
±12V,
R
BIAS
= 43.2k (Note 6)
V
S
=
±12V,
R
BIAS
= 66.5k (Note 6)
V
S
=
±5V,
R
BIAS
= 24.9k (Note 6)
q
8.0
6.7
13.5
15.0
mA
mA
mA
mA
mA
mA
mA
mA
mA
dB
dB
V/µs
V/µs
dBc
dBc
MHz
2.2
1.8
3.4
0.1
0.3
5.0
5.8
1
1
Supply Current in Shutdown
Output Leakage in Shutdown
Channel Separation
SR
HD2
HD3
GBW
Slew Rate
Differential 2nd Harmonic Distortion
Differential 3rd Harmonic Distortion
Gain Bandwidth
V
SHDN
= 0.4V
V
SHDN
= 0.4V
V
S
=
±12V,
V
OUT
=
±10V,
R
L
= 40Ω
q
80
77
300
100
110
600
200
– 85
– 82
200
V
S
=
±12V,
A
V
= – 10, (Note 7)
V
S
=
±5V,
A
V
= –10, (Note 7)
V
S
=
±12V,
A
V
= 10, 2V
P-P
, R
L
= 50Ω, 1MHz
V
S
=
±12V,
A
V
= 10, 2V
P-P
, R
L
= 50Ω, 1MHz
f = 1MHz
Note 1:
Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2:
Applies to short circuits to ground only. A short circuit between
the output and either supply may permanently damage the part when
operated on supplies greater than
±10V.
Note 3:
The LT6300C is guaranteed to meet specified performance from
0°C to 70°C and is designed, characterized and expected to meet these
extended temperature limits, but is not tested at – 40°C and 85°C. The
LT6300I is guaranteed to meet the extended temperature limits.
Note 4:
Thermal resistance varies depending upon the amount of PC board
metal attached to Pins 1, 8, 9, 16 of the device. If the maximum
dissipation of the package is exceeded, the device will go into thermal
shutdown and be protected.
Note 5:
Guaranteed by the CMRR tests.
Note 6:
R
BIAS
is connected between V
+
and the SHDN pin, with the
SHDNREF pin grounded.
Note 7:
Slew rate is measured at
±5V
on a
±10V
output signal while
operating on
±12V
supplies and
±1V
on a
±3V
output signal while
operating on
±5V
supplies.
3