LT1011/LT1011A
W
W
SCHE ATIC DIAGRA
+
OFFSET
5
OFFSET/STROBE
6
V
8
R8
800Ω
R9
800Ω
Q6
Q10
R1
1.3k
R2
1.3k
R4
300Ω
R3
300Ω
R23
4k
R27
3k
R5
160Ω
Q11
Q5
Q31
Q12
R10
4k
R6
3.2k
R7
3.2k
Q13
D1 D2
Q30
R11
170Ω
INPUT
(+)
Q8
Q7
D4
OUTPUT
7
D6
Q29
Q14
2
Q3
Q20
R22
200Ω
Q1
Q15
Q9 Q19
Q28
R12
470Ω
INPUT
(–)
D5
Q4
D7
Q27
R16
800Ω
3
Q2
Q24
Q16
R17
200Ω
R24
400Ω
R13
4Ω
Q26
Q23
Q21
Q25
R15
700Ω
R20
940Ω
1
Q22
Q18
Q17
GND
R25
1.6k
R26
1.6k
R19
500Ω
R18
275Ω
R21
960Ω
R14
4.8k
D3
4
1011 SD
–
V
U
PACKAGE DESCRIPTION
Dimensions in inches (millimeters) unless otherwise noted.
H Package
8-Lead TO-5 Metal Can (.230 Inch PCD)
(Reference LTC DWG # 05-08-1321)
0.335 – 0.370
(8.509 – 9.398)
DIA
OBSOLETE PACKAGE
0.027 – 0.045
(0.686 – 1.143)
0.305 – 0.335
(7.747 – 8.509)
0.040
45°TYP
PIN 1
0.028 – 0.034
(0.711 – 0.864)
0.050
(1.270)
MAX
(1.016)
MAX
0.165 – 0.185
(4.191 – 4.699)
0.230
(5.842)
REFERENCE
PLANE
SEATING
PLANE
TYP
GAUGE
PLANE
0.500 – 0.750
(12.700 – 19.050)
0.010 – 0.045*
(0.254 – 1.143)
0.016 – 0.021**
(0.406 – 0.533)
H8 (TO-5) 0.230 PCD 1197
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
0.016 – 0.024
**FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
(0.406 – 0.610)
14