LT3517
PACKAGE DESCRIPTION
UF Package
16-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1692)
NOTE:
0.72 p 0.05
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (W
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON A
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
4.35 p 0.05
2.90 p 0.05
2.15 p 0.05
(4 SIDES)
PACKAGE OUTLINE
0.30 p 0.05
0.65 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH R = 0.20 TYP
R = 0.115
OR 0.35 s 45o CHAMFER
0.75 p 0.05
4.00 p 0.10
(4 SIDES)
TYP
15
16
0.55 p 0.20
PIN 1
TOP MARK
(NOTE 6)
1
2
2.15 p 0.10
(4-SIDES)
(UF16) QFN 1004
0.200 REF
0.30 p 0.05
0.65 BSC
0.00 – 0.05
3517fa
18
Linear [ Linear ]
