LT1963A Series
pacKage DescripTion
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev J)
Exposed Pad Variation BB
4.70
(.185)
3.58
DETAIL A
4.90 – 5.10*
(.193 – .201)
0.56
(.022)
REF
(.141)
3.58
(.141)
0.53
(.021)
REF
NOTE 5
16 1514 13 12 1110
9
NOTE 5
DETAIL A IS THE PART OF THE
LEAD FRAM FEATURE FOR
REFERENCE ONLY
6.60 ±0.10
2.94 3.05
(.116) (.120)
4.50 ±0.10
DETAIL A
NO MEASUREMENT PUROSE
6.40
(.252)
BSC
SEE NOTE 4
2.94
(.116)
1.05 ±0.10
0.45 ±0.05
0.65 BSC
5
7
8
1
2
3
4
6
RECOMMENDED SOLDER PAD LAYOUT
1.10
(.0433)
MAX
4.30 – 4.50*
(.169 – .177)
0.25
REF
0° – 8°
0.65
(.0256)
BSC
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
0.05 – 0.15
(.002 – .006)
FE16 (BB) TSSOP REV J 1012
0.195 – 0.30
(.0077 – .0118)
TYP
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
5. BOTTOM EXPOSED PADDLE MAY HAVE METAL PROTRUSION
IN THIS AREA. THIS REGION MUST BE FREE OF ANY EXPOSED
TRACES OR VIAS ON PBC LAYOUT
MILLIMETERS
2. DIMENSIONS ARE IN
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
3. DRAWING NOT TO SCALE
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
1963aff
26
For more information www.linear.com/LT1963A
Linear [ Linear ]
