LT1395/LT1396/LT1397
U
PACKAGE DESCRIPTIO
DE Package
14-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1708 Rev B)
R = 0.115
TYP
0.40 ± 0.10
4.00 ±0.10
(2 SIDES)
8
14
R = 0.05
TYP
0.70 ±0.05
3.60
±0.05
1.70 ±0.05
(2 SIDES)
1.70 ± 0.05
PIN 1
2.20
(2 SIDES)
NOTCH
PACKAGE
OUTLINE
±0.05
3.00 ±0.10
R = 0.20 OR
(2 SIDES)
0.35 × 45°
PIN 1
TOP MARK
(SEE NOTE 6)
CHAMFER
(DE14) DFN 0905 REV A
7
1
0.25 ± 0.05
0.75 ±0.05
0.25 ± 0.05
0.50
BSC
0.200 REF
0.50 BSC
3.30 ±0.05
(2 SIDES)
3.30 ±0.05
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF
VERSION (WGED-3) IN JEDEC PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3. ALL DIMENSIONS ARE IN MILLIMETERS
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.189 – .196*
(4.801 – 4.978)
.045 ±.005
.009
(0.229)
REF
16 15 14 13 12 11 10 9
.254 MIN
.150 – .165
.229 – .244
.150 – .157**
(5.817 – 6.198)
(3.810 – 3.988)
.0165 ± .0015
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
1
2
3
4
5
6
7
8
.015 ± .004
(0.38 ± 0.10)
× 45°
.0532 – .0688
(1.35 – 1.75)
.004 – .0098
(0.102 – 0.249)
.007 – .0098
(0.178 – 0.249)
0° – 8° TYP
.016 – .050
(0.406 – 1.270)
.0250
(0.635)
BSC
.008 – .012
GN16 (SSOP) 0204
(0.203 – 0.305)
TYP
NOTE:
1. CONTROLLING DIMENSION: INCHES
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
2. DIMENSIONS ARE IN
(MILLIMETERS)
3. DRAWING NOT TO SCALE
139567fc
14
Linear [ Linear ]
