LTM4616
APPLICATIONS INFORMATION
Layout Checklist/Example
•ꢀ To minimizetheviaconductionlossandreducemodule
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
The high integration of LTM4616 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout con-
siderations are still necessary.
•ꢀ Do not put vias directly on the pads, unless they are
capped or plated over.
•ꢀ Use large PCB copper areas for high current paths,
•ꢀ Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to GND underneath the unit.
including V , V , GND1 and GND2, V and
IN1
IN2
OUT1
V
. It helps to minimize the PCB conduction loss
and thermal stress.
OUT2
•ꢀ For parallel modules, tie the I , FB and I
pins to-
THM
TH
•ꢀ Place high frequency ceramic input and output capaci-
gether. Use an internal layer to closely connect these
tors next to the V , GND and V
pins to minimize
pins together. All of the I pins connect to the SGND
ofthemasterregulator,thenthemasterSGNDconnects
IN
OUT
THM
high frequency noise.
to GND.
•ꢀ Place a dedicated power ground layer underneath the
unit.
Figure17givesagoodexampleoftherecommendedlayout.
V
IN1
V
OUT1
VIA TO GND
EACH CHANNEL
CONTROL1
M
L
C
OUT2
V
OUT1
C
IN1
V
IN1
K
J
H
G
F
GND1
GND1
CONTROL1 & 2
C
OUT2
E
V
OUT2
V
IN2
C
IN2
D
C
B
A
GND2
GND2
1
2
3
4
5
6
7
8
9
10
11
12
4616 F17
GND2
CONTROL2
LTM4616 TOP VIEW
GND2
Figure 17. Recommended PCB Layout
(LGA and BGA PCB Layouts Are Identical with the Exception of Circle Pads for BGA. See Package Description.)
4616fe
21
For more information www.linear.com/LTM4616
LINEAR_DIMENSIONS [ Linear Dimensions ]
