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LTC2378IMS-16 参数 Datasheet PDF下载

LTC2378IMS-16图片预览
型号: LTC2378IMS-16
PDF下载: 下载PDF文件 查看货源
内容描述: 16位, 1Msps的,低功耗SAR型ADC的SNR 97分贝 [16-Bit, 1Msps, Low Power SAR ADC with 97dB SNR]
分类和应用:
文件页数/大小: 24 页 / 765 K
品牌: LINEAR_DIMENSIONS [ Linear Dimensions ]
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LTC2378-16  
package DescripTion  
DE Package  
16-5ead Plastic DFN ꢁ4mm × 3mmx  
(Reference LTC DWG # ±5-±8-1732 Rev Ø)  
R = 0.ꢀꢀ5  
0.40 0.ꢀ0  
ꢀ6  
4.00 0.ꢀ0  
(2 SIDES)  
TYP  
9
0.70 0.05  
R = 0.05  
TYP  
3.30 0.05  
ꢀ.70 0.05  
3.30 0.ꢀ0  
3.60 0.05  
2.20 0.05  
3.00 0.ꢀ0  
(2 SIDES)  
PACKAGE  
OUTLINE  
ꢀ.70 0.ꢀ0  
PIN ꢀ NOTCH  
R = 0.20 OR  
PIN ꢀ  
0.35 × 45°  
TOP MARK  
(SEE NOTE 6)  
CHAMFER  
(DEꢀ6) DFN 0806 REV Ø  
8
0.23 0.05  
0.45 BSC  
0.75 0.05  
0.200 REF  
0.25 0.05  
0.45 BSC  
3.ꢀ5 REF  
BOTTOM VIEW—EXPOSED PAD  
3.ꢀ5 REF  
0.00 – 0.05  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED  
NOTE:  
ꢀ. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC  
PACKAGE OUTLINE MO-229  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.ꢀ5mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN ꢀ LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
MS Package  
16-5ead Plastic MSOP  
(Reference LTC DWG # ±5-±8-1669 Rev Ø)  
4.039 ± 0.102  
(.159 ± .004)  
(NOTE 3)  
0.889 ± 0.127  
(.035 ± .005)  
0.280 ± 0.076  
(.011 ± .003)  
REF  
16151413121110  
9
3.00 ± 0.102  
(.118 ± .004)  
(NOTE 4)  
DETAIL “A”  
0° – 6° TYP  
5.23  
4.90 ± 0.152  
(.193 ± .006)  
3.20 – 3.45  
(.206)  
0.254  
(.010)  
(.126 – .136)  
MIN  
GAUGE PLANE  
0.53 ± 0.152  
(.021 ± .006)  
1 2 3 4 5 6 7 8  
0.50  
(.0197)  
BSC  
0.305 ± 0.038  
(.0120 ± .0015)  
TYP  
0.86  
(.034)  
REF  
1.10  
(.043)  
MAX  
DETAIL “A”  
0.18  
(.007)  
RECOMMENDED SOLDER PAD LAYOUT  
SEATING  
PLANE  
NOTE:  
0.17 – 0.27  
(.007 – .011)  
TYP  
1. DIMENSIONS IN MILLIMETER/(INCH)  
2. DRAWING NOT TO SCALE  
0.1016 ± 0.0508  
(.004 ± .002)  
MSOP (MS16) 1107 REV Ø  
0.50  
(.0197)  
BSC  
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.  
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX  
237816f  
ꢁnformation furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
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