LT8697
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UDD Package
24-Lead Plastic QꢁN (ꢀmm × 5mm)
(Reference LTC DWG # 05-08-1833 Rev Ø)
0.70 0.05
3.50 0.05
2.ꢀ0 0.05
ꢀ.50 REF
3.65 0.05
ꢀ.65 0.05
PACKAGE OUTLINE
0.25 0.05
0.50 BSC
3.50 REF
4.ꢀ0 0.05
5.50 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
PIN ꢀ NOTCH
R = 0.20 OR 0.25
0.75 0.05
× 45° CHAMFER
ꢀ.50 REF
23
R = 0.05 TYP
3.00 0.ꢀ0
24
0.40 0.ꢀ0
PIN ꢀ
TOP MARK
(NOTE 6)
ꢀ
2
3.65 0.ꢀ0
ꢀ.65 0.ꢀ0
5.00 0.ꢀ0
3.50 REF
(UDD24) QFN 0808 REV Ø
0.200 REF
0.00 – 0.05
0.25 0.05
0.50 BSC
R = 0.ꢀꢀ5
TYP
BOTTOM VIEW—EXPOSED PAD
NOTE:
ꢀ. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.ꢀ5mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN ꢀ LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
8697p
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
27
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
For more information www.linear.com/LT8697
LINEAR_DIMENSIONS [ Linear Dimensions ]
