LND820/821/822/823
ABSOLUTE MAXIMUM RATING
Symbol
I
D
@Tc=25ºC
I
D
@Tc=100ºC
I
DM
P
D
@Tc=25ºC
I
D
@Tc=25ºC
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
Parameter
Continuous Drain Current,V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current(1)
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy(2)
Avalanche Current (1)
Repetitive Avalanche Energy (1)
Peak Diode Recovery dv/dt(3)
Operating Junction and Storage
temperature Range
Soldering Temperature, for 10
seconds
Max
2.5
1.6
8.0
50
0.40
±20
210
2.5
5.0
3.5
-55 to +150
300
(1.6mm from case)
Units
A
W
W/ºC
V
mJ
A
mJ
V/ns
ºC
THERMAL RESISTANCE
Symbol
Ro
JC
Ro
CS
Ro
JA
Parameter
Junction-to-case
Case-to-Sink, Flat,
Greased Surface
Junction-to-Ambint
Min
-
-
-
Typ
-
0.50
-
Max
2.5
-
62
Units
ºC/W
•
Linear Dimensions, Inc.
•
445 East Ohio Street, Chicago IL 60611 USA
•
tel 312.321.1810
•
fax 312.321.1830
•
•
LINEAR_DIMENSIONS [ LINEAR DIMENSIONS SEMICONDUCTOR ]
