LTC3890
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UH Package
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693 Rev D)
0.70 ±0.05
5.50 ±0.05
4.10 ±0.05
3.45 ± 0.05
3.50 REF
(4 SIDES)
3.45 ± 0.05
PACKAGE OUTLINE
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 × 45° CHAMFER
R = 0.05
TYP
0.00 – 0.05
R = 0.115
TYP
0.75 ± 0.05
5.00 ± 0.10
(4 SIDES)
31 32
0.40 ± 0.10
PIN 1
TOP MARK
(NOTE 6)
1
2
3.45 ± 0.10
3.50 REF
(4-SIDES)
3.45 ± 0.10
(UH32) QFN 0406 REV D
0.200 REF
0.25 ± 0.05
0.50 BSC
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3890fb
38
Linear Systems [ Linear Systems ]
