LTC2379-18
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DE Package
16-ꢀead Plastic DFN ꢂ4mm × 3mmx
(Reference LTC DWG # 05-08-1732 Rev Ø)
R = 0.115
0.40 0.10
16
4.00 0.10
(2 SꢁDES)
TYP
9
0.70 0.05
R = 0.05
TYP
3.30 0.05
3.60 0.05
3.30 0.10
3.00 0.10
(2 SꢁDES)
PACKAGE
OUTLꢁIE
2.20 0.05
1.70 0.05
1.70 0.10
PꢁI 1 IOTCH
R = 0.20 OR
PꢁI 1
0.35 s 45°
TOP MARK
(SEE IOTE 6)
CHAMFER
(DE16) DFI 0806 REV Ø
8
1
0.23 0.05
0.45 ꢀSC
0.75 0.05
0.200 REF
0.25 0.05
0.45 ꢀSC
3.15 REF
ꢀOTTOM VꢁEW—EXPOSED PAD
3.15 REF
0.00 – 0.05
RECOMMEIDED SOLDER PAD PꢁTCH AID DꢁMEISꢁOIS
APPLY SOLDER MASK TO AREAS THAT ARE IOT SOLDERED
IOTE:
1. DRAWꢁIG PROPOSED TO ꢀE MADE VARꢁATꢁOI OF VERSꢁOI (WGED-3) ꢁI JEDEC
PACKAGE OUTLꢁIE MO-229
2. DRAWꢁIG IOT TO SCALE
3. ALL DꢁMEISꢁOIS ARE ꢁI MꢁLLꢁMETERS
4. DꢁMEISꢁOIS OF EXPOSED PAD OI ꢀOTTOM OF PACKAGE DO IOT ꢁICLUDE
MOLD FLASH. MOLD FLASH, ꢁF PRESEIT, SHALL IOT EXCEED 0.15mm OI AIY SꢁDE
5. EXPOSED PAD SHALL ꢀE SOLDER PLATED
6. SHADED AREA ꢁS OILY A REFEREICE FOR PꢁI 1 LOCATꢁOI OI THE
TOP AID ꢀOTTOM OF PACKAGE
237918fa
23
Linear Systems [ Linear Systems ]
