LTC1706-63
TYPICAL APPLICATIO
1µF
X5R
100k 3
4
1500pF
20k
5
6
7
0.01µF
8
330k
9
10
5V
22pF
FROM
µP
PACKAGE DESCRIPTION
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
0.889
±
0.127
(.035
±
.005)
3.00
±
0.102
(.118
±
.004)
(NOTE 3)
10 9 8 7 6
0.497
±
0.076
(.0196
±
.003)
REF
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.254
(.010)
DETAIL “A”
0° – 6° TYP
0.50
0.305
±
0.038
(.0197)
(.0120
±
.0015)
BSC
TYP
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
U
1.025V to 1.4125V VID Programmable 15A Power Supply
V
IN
12V
CMDSH-3
1
2
RUN/SS
V
ON
BOOST
TG
SW
SENSE
+
SENSE
–
20
19
18
17
16
0.22µF
LTC3778
10µF
16V
X5R
×4
IRF7811
PGOOD
V
RNG
I
TH
FCB
SGND
I
ON
V
FB
EXTV
CC
0.68µH
SP
270µF
2V
×3
V
OUT
1.025V TO 1.4125V
15A
22µF
6.3V
X5R
B320A
15
IRF7811
14
13
4.7µF
X5R
6.3V
12
11
1Ω
V
IN
0.1µF
PGND
BG
DRV
CC
INTV
CC
V
IN
5
1
2
3
4
7
6
VID0
SENSE
VID1
VID2 LTC1706-63
VID3
FB
VID4
GND
10
9
V
CC
1706-63 TA02
4.90
±
0.15
(1.93
±
.006)
3.00
±
0.102
(.118
±
.004)
NOTE 4
GAUGE PLANE
1 2 3 4 5
0.53
±
0.01
(.021
±
.006)
DETAIL “A”
0.18
(.007)
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
TYP
0.13
±
0.076
(.005
±
.003)
MSOP (MS) 0802
1.10
(.043)
MAX
0.86
(.034)
REF
0.50
(.0197)
BSC
170663f
7
LINEAR [ LINEAR INTEGRATED SYSTEMS ]
