LTC3261
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MSE Package
12-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev F)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 0.102
(.112 .004)
2.845 0.102
(.112 .004)
0.889 0.127
(.035 .005)
1
6
0.35
REF
1.651 0.102
(.065 .004)
5.23
(.206)
MIN
1.651 0.102
(.065 .004)
3.20 – 3.45
(.126 – .136)
0.12 REF
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
DETAIL “B”
12
4.039 0.102
7
0.65
(.0256)
BSC
0.42 0.038
(.0165 .0015)
TYP
(.159 .004)
(NOTE 3)
0.406 0.076
RECOMMENDED SOLDER PAD LAYOUT
(.016 .003)
12 11 10 9 8 7
REF
DETAIL “A”
0.254
(.010)
3.00 0.102
(.118 .004)
(NOTE 4)
0° – 6° TYP
4.90 0.152
(.193 .006)
GAUGE PLANE
0.53 0.152
(.021 .006)
1
2 3 4 5 6
DETAIL “A”
0.86
(.034)
REF
1.10
(.043)
MAX
0.18
(.007)
SEATING
PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.1016 0.0508
(.004 .002)
0.650
(.0256)
BSC
MSOP (MSE12) 0911 REV F
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.
3261f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
Linear Systems [ Linear Systems ]
