LT3463/LT3463A
U
TYPICAL APPLICATIO
Dual Output ±20V Converter
L1
10µH
V
V
OUT1
IN
20V
2.7V
9mA
R2
TO 5V C1
1M
1µF
3
2
1
C2
0.47µF
V
SW1 V
IN
OUT1
R1
66.5k
9
8
10
7
SHDN1
FB1
LT3463
V
REF
6
R3
61.9k
SHDN2
GND
11
FB2
D2
5
SW2
4
R4
1M
C4
0.1µF
L2
10µH
D1
V
OUT2
–20V
9mA
C3
0.47µF
3463 TA02
U
PACKAGE DESCRIPTIO
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
R = 0.115
TYP
6
0.38 ± 0.10
10
0.675 ±0.05
3.50 ±0.05
2.15 ±0.05 (2 SIDES)
1.65 ±0.05
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
PIN 1
PACKAGE
OUTLINE
TOP MARK
(SEE NOTE 6)
(DD10) DFN 1103
5
1
0.25 ± 0.05
0.50 BSC
0.75 ±0.05
0.200 REF
0.25 ± 0.05
0.50
BSC
2.38 ±0.10
(2 SIDES)
2.38 ±0.05
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
3463f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
7
Linear Systems [ Linear Systems ]
