LT1101
U
PACKAGE DESCRIPTIO
H Package
8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320)
.335 – .370
(8.509 – 9.398)
DIA
.305 – .335
(7.747 – 8.509)
.040
(1.016)
MAX
.050
(1.270)
MAX
.165 – .185
(4.191 – 4.699)
REFERENCE
PLANE
SEATING
PLANE
GAUGE
PLANE
.500 – .750
(12.700 – 19.050)
.010 – .045*
(0.254 – 1.143)
.016 – .021**
(0.406 – 0.533)
.027 – .045
(0.686 – 1.143)
PIN 1
45°TYP
.028 – .034
(0.711 – 0.864)
.200
(5.080)
TYP
.110 – .160
(2.794 – 4.064)
INSULATING
STANDOFF
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND THE SEATING PLANE
.016 – .024
(0.406 – 0.610)
**FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS
H8(TO-5) 0.200 PCD 0801
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
.405
(10.287)
MAX
CORNER LEADS OPTION
(4 PLCS)
.005
(0.127)
MIN
6
5
4
8
7
.023 – .045
(0.584 – 1.143)
HALF LEAD
OPTION
.025
(0.635)
RAD TYP
.220 – .310
(5.588 – 7.874)
.045 – .068
(1.143 – 1.650)
FULL LEAD
OPTION
1
2
3
.200
(5.080)
MAX
.300 BSC
(7.62 BSC)
.015 – .060
(0.381 – 1.524)
.008 – .018
(0.203 – 0.457)
0° – 15°
.045 – .065
(1.143 – 1.651)
.125
3.175
MIN
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
.014 – .026
(0.360 – 0.660)
.100
(2.54)
BSC
J8 0801
OBSOLETE PACKAGES
1101fa
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15
Linear Systems [ Linear Systems ]
