LT1082
U
PACKAGE DESCRIPTIO
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
0.400*
(10.160)
MAX
0.130 ± 0.005
0.300 – 0.325
0.045 – 0.065
(3.302 ± 0.127)
(1.143 – 1.651)
(7.620 – 8.255)
8
1
7
6
5
0.065
(1.651)
TYP
0.255 ± 0.015*
(6.477 ± 0.381)
0.009 – 0.015
(0.229 – 0.381)
0.125
0.020
(0.508)
MIN
(3.175)
MIN
+0.035
–0.015
2
4
3
0.325
0.018 ± 0.003
0.100
(2.54)
BSC
+0.889
8.255
(0.457 ± 0.076)
(
)
N8 1098
–0.381
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
Q Package
5-Lead Plastic DD Pak
(Reference LTC DWG # 05-08-1461)
.060
(1.524)
TYP
.390 – .415
(9.906 – 10.541)
.060
(1.524)
.165 – .180
(4.191 – 4.572)
.256
(6.502)
.045 – .055
(1.143 – 1.397)
15° TYP
+.008
.004
–.004
.060
(1.524)
.059
(1.499)
TYP
.183
(4.648)
.330 – .370
(8.382 – 9.398)
+0.203
–0.102
0.102
(
)
.095 – .115
(2.413 – 2.921)
.075
(1.905)
.067
(1.702)
BSC
.050 ± .012
(1.270 ± 0.305)
.300
(7.620)
.013 – .023
(0.330 – 0.584)
+.012
.143
–.020
.028 – .038
(0.711 – 0.965)
TYP
+0.305
BOTTOM VIEW OF DD PAK
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
3.632
Q(DD5) 0502
(
)
–0.508
.420
.276
.080
.420
.350
.325
.205
.565
.565
.320
.090
.042
.090
.042
.067
.067
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
RECOMMENDED SOLDER PAD LAYOUT
FOR THICKER SOLDER PASTE APPLICATIONS
1. DIMENSIONS IN INCH/(MILLIMETER)
2. DRAWING NOT TO SCALE
sn1082 1082fas
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
11
Linear Systems [ Linear Systems ]
