NH033x-L and NH050x-L Series Power Modules:
5 Vdc Input; 1.2 Vdc to 3.3 Vdc Output; 10 A and 15 A
Data Sheet
March 2010
General Specifications
Parameter
Calculated MTBF (IO = 80% of IO, max; TA = 40 °C)
Weight
Min
Typ
1,300,000
—
Max
Unit
hours
g (oz.)
—
14 (0.5)
Cleanliness Requirements
The open frame (no case or potting) power modules meet specification J-STD-001B. These requirements state
that any solder balls must be attached and their size should not compromise the minimum electrical spacing of the
power module.
The cleanliness designator of the open frame power module is C00 (per J specification).
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions and Design Considerations sections for further information.
Parameter
Symbol
Min
Typ
Max
Unit
Remote On/Off Signal Interface
(VI = 4.5 V to 5.5 V; open collector pnp transistor or
equivalent; signal referenced to GND pin; see Figure 38
and Feature Descriptions section.):
Logic Low (ON/OFF pin open)—Module On:
Ion/off = 0.0 µA
Von/off
Ion/off
–0.7
—
—
—
0.3
50
V
µA
Von/off = 0.3 V
Logic High (Von/off > 2.8 V)—Module Off:
Ion/off = 10 mA
Von/off = 5.5 V
Turn-on Time (IO = IO, max; VO within ±1% of steady
state; see Figures 25—32.)
Von/off
Ion/off
—
—
—
—
—
—
3.0
6.0
10
—
V
mA
ms
Output Voltage Adjustment*
(See Feature Descriptions section.):
Output Voltage Remote-sense Range:
For VO ≥ 2.5 V
—
—
—
—
—
—
10
20
% VO, nom
% VO, nom
For VO < 2.5 V
Output Voltage Set-point Adjustment Range (Trim):
For VO ≥ 2.5 V
VTRIM
VTRIM
90
100
—
—
110
120
% VO, nom
% VO, nom
For VO < 2.5 V
Overtemperature Protection (shutdown)
(See Feature Descriptions section.)
TQ32
115
120
—
°C
* Total adjustment of trim and remote sense combined should not exceed 10% for VO ≥ 2.5 V or 20% for VO < 2.5 V.
4
Lineage Power