Data Sheet
KW010/015/020/025 Series Power Modules:
March 26, 2008
36 – 75Vdc Input; 1.2 to 5.0Vdc Output; 10 to 25A Output current
instructions must be observed when soldering these
Surface Mount Information
units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
Pick and Place
The KW010-025 modules use an open frame
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
construction and are designed for a fully automated
assembly process. The pick and place location on
the module is the larger magnetic core as shown in
Figure 46. The modules are fitted with a label which
meets all the requirements for surface mount
processing, as well as safety standards, and is able to
withstand reflow temperatures of up to 300oC. The
label also carries product information such as product
code, serial number and the location of manufacture.
300
Peak Temp 235oC
250
Cooling
zone
Heat zone
max 4oCs-1
200
150
10 0
50
1- 4 oCs-1
Soak zone
30-240s
T
lim above
205oC
Preheat zone
max 4oCs-1
Figure 46. Pick and Place Location.
Nozzle Recommendations
0
REFLOW TIME (S)
Figure 47. Reflow Profile for Tin/Lead (Sn/Pb)
process
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The recommended nozzle diameter for reliable
operation is 6mm. Oblong or oval nozzles up to 11 x 6
mm may also be used within the space available.
240
235
230
225
220
215
210
205
200
Tin Lead Soldering
The KW010-025 power modules (both non-Z and –Z
codes) can be soldered either in a conventional
Tin/Lead (Sn/Pb) process. The non-Z version of the
KW010-025 modules are RoHS compliant with the
lead exception. Lead based solder paste is used in
the soldering process during the manufacturing of
these modules. These modules can only be soldered
in conventional Tin/lead (Sn/Pb) process. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly. The following
0
10
20
30
40
50
60
Figure 48. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process
LINEAGE POWER
16
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
