Data Sheet
GE
KSTW002A5B Barracuda* Series; DC-DC Converter Power Modules
36-75Vdc Input; 12Vdc, 2.5A Output
Figure 17. EMC signature using above filter, KSTW002A5B,
Vin=48V, Blue=PK, Red=Avg.
LOCAL AMBIENT TEMPERATURE, TA (C)
Figure 14. Output Current Derating for the Open Frame
KSTW002A5B in the Transverse Orientation; Airflow
Direction from Vin(-) to Vin(+); Vin = 48V.
For further information on designing for EMC compliance,
please refer to the FLTR100V10 data sheet (FDS01-043EPS).
The thermal reference point, Tref, used in the specifications is
shown in Figure 15. For reliable operation this temperature
should not exceed 119oC.
Layout Considerations
The KSTW002A5B power modules are low profile in order to be
used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the power
module. Also avoid placing via interconnects underneath the
power module.
For additional layout guide-lines, refer to the FLTR100V10 data
sheet.
The KSTW002A5B power modules are available for either
Through-Hole (TH) or Surface Mount (SMT) soldering.
Figure 15. Tref Temperature Measurement Location.
Through-Hole Soldering Information
The RoHS-compliant (Z codes) through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
EMC Requirements
Figure 16 shows a maximum filter configuration to meet the
conducted emission limits of EN55022 Class B.
components. They are designed to be processed through
single or dual wave soldering machines. The pins have an
RoHS-compliant finish that is compatible with both Pb and Pb-
free wave soldering processes. A maximum preheat rate of
3C/s is suggested. The wave preheat process should be such
that the temperature of the power module board is kept below
210C. For Pb solder, the recommended pot temperature is
260C, while the Pb-free solder pot is 270C max. Not all RoHS-
compliant through-hole products can be processed with paste-
through-hole Pb or Pb-free reflow process. If additional
information is needed, please consult with your GE
Notes: C1 and C4 are low impedance SMT ceramics.
representative for more details.
Ci
See Figure 7
C1, C4 2.2uF, 100V, 1210
1210Y1K50103KXTDWV, 10nF, 1500V (*2)
C2, C3
C5, C6
RDHX223K302HKT, 22nF, 3kv
RDHX333K302HKT, 33nF, 3000V (Holystone)
202S48W334KT, 33nF, 2000V (Johanson)
Figure 16. Suggested Configuration for EN55022 Class B
September 26, 2013
©2013 General Electric Corporation. All rights reserved.
Page 9
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
