Data Sheet
GE
KBVW006A0B Series Sixteenth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 6A Output Current
Peak Temp. 240-245°C
Ramp down
max. 4°C/Sec
217°C
200°C
Time Limited 90 Sec.
above 217°C
150°C
Preheat time
100-150 Sec.
Ramp up
max. 3°C/Sec
Figure 20. Recommended linear reflow profile using
Sn/Ag/Cu solder.
25°C
Time
Figure 21. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant, Z option, through-hole products
use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-
compliant components. They are designed to be
processed through single or dual wave soldering
machines. The pins have a RoHS-compliant, pure tin
finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3C/s is
suggested. The wave preheat process should be such
that the temperature of the power module board is kept
below 210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is
270C max.
MSL Rating
The modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture Barrier Bags (MBB)
with desiccant are required for MSL ratings of 2 or
greater. These sealed packages should not be broken
until time of use. Once the original package is broken,
the floor life of the product at conditions of 30°C and
60% relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT
packages will be a minimum of 12 months from the bag
seal date, when stored at the following conditions: < 40°
C, < 90% relative humidity.
Reflow Lead-Free Soldering Information
The RoHS-compliant through-hole products (with the
exception of modules that come with heat plate option –
H) can be processed with the following paste-through-
hole Pb or Pb-free reflow process.
Max. sustain temperature:
Post Solder Cleaning and Drying
Considerations
245C (J-STD-020C Table 4-2: Packaging
Thickness>=2.5mm / Volume > 2000mm3),
Peak temperature over 245C is not suggested due to
the potential reliability risk of components under
continuous high-temperature.
Min. sustain duration above 217C: 90 seconds
Min. sustain duration above 180C: 150 seconds
Max. heat up rate: 3C/sec
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of
the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Lineage Power Board
Max. cool down rate: 4C/sec
In compliance with JEDEC J-STD-020C spec for 2 times
reflow requirement.
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001)
Pb-free Reflow Profile
BMP module (with the exception of modules that come
with heat plate option –H) will comply with J-STD-020
Rev. C (Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification
procedures. BMP will comply with JEDEC J-STD-020C
specification for 3 times reflow requirement. The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Figure 21.
July 9, 2013
©2012 General Electric Company. All rights reserved.
Page 11
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
