JW050F, JW075F, JW100F, JW150F Power Modules:
dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 99 W
Data Sheet
April 2008
Thermal Considerations (continued)
Custom Heat Sinks (continued)
Solder, Cleaning, and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical testing. The result
of inadequate circuit-board cleaning and drying can
affect both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning, and dry-
ing procedures, refer to the Board-Mounted Power
Modules Soldering and Cleaning Application Note
(AP97-021EPS).
For a managed interface using thermal grease or foils,
a value of θcs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
(TC – TA)
θsa = ------------------------ – θcs
PD
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(DS98-152EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. For additional layout guide-
lines, refer to the FLTR100V10 data sheet
(DS98-152EPS).
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Lineage Power
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
