Data Sheet
GE
JRCW450U Orca Series; DC-DC Converter Power Modules
36–75 Vdc Input; 48.0Vdc Output; 450W Output
Thermal Considerations (continued)
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to GE Board
Mounted Power Modules: Soldering and Cleaning Application
Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
They are designed to be processed through single or dual
wave soldering machines. The pins have a RoHS-compliant
finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3C/s is
suggested. The wave preheat process should be such that
the temperature of the power module board is kept below
210C. For Pb solder, the recommended pot temperature is
260C, while the Pb-free solder pot is 270C max. The
JRCW450U cannot be processed with paste-through-hole Pb
or Pb-free reflow process. If additional information is needed,
please consult with your GE representative for more details.
Cold Plate (inside surface) Temperature, TC (oC)
Figure 20. Derating Output Power in conduction cooling
(cold plate) applications, Vin=48V.
Layout Considerations
The JRCW450U power module series are constructed using a
single PWB with integral base plate; as such, component
clearance between the bottom of the power module and the
mounting (Host) board is limited. Avoid placing copper areas
on the outer layer directly underneath the power module.
June 7, 2013
©2012 General Electric Company. All rights reserved.
Page 11
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