Data Sheet
GE
JRCK017A0S32R0 Orca Series; DC-DC Converter Power Modules
36–62 Vdc Input; 32.0Vdc Output; 17.0Adc Output
Layout Considerations
Through-Hole Lead-Free Soldering
Information
The JRCK017S32R0 power module series are constructed
using a single PWB with integral base plate; as such,
component clearance between the bottom of the power
module and the mounting (Host) board is limited. Avoid
placing copper areas on the outer layer directly underneath
the power module.
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
They are designed to be processed through single or dual
wave soldering machines. The pins have an RoHS-compliant
finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3C/s is
suggested. The wave preheat process should be such that
the temperature of the power module board is kept below
210C. For Pb solder, the recommended pot temperature is
260C, while the Pb-free solder pot is 270C max. The
JRCK017S32R0 can not be processed with paste-through-
hole Pb or Pb-free reflow process. If additional information is
needed, please consult with your GE representative for more
details.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to GE Board
Mounted Power Modules: Soldering and Cleaning Application
Note.
October 11, 2013
©2012 General Electric Company. All rights reserved.
Page 12
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