JAW050A and JAW075A Power Modules; dc-dc Converters:
36 Vdc to 75 Vdc Input, 5 Vdc Output; 50 W to 75 W
Data Sheet
April 2008
General Specifications
Parameter
Calculated MTBF (I
O
= 80% of I
O, max
; T
C
= 40 °C)
Weight
—
Min
Typ
3,000,000
—
100 (3.5)
Max
Unit
hours
g (oz.)
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See the Feature Descriptions section for additional information.
Parameter
Remote On/Off Signal Interface
(V
I
= 0 V to 75 V; open collector or equivalent compatible;
signal referenced to V
I
(–) terminal):
JAWxxxA1 Preferred Logic:
Logic Low—Module On
Logic High—Module Off
JAWxxxA Optional Logic:
Logic Low—Module Off
Logic High—Module On
Logic Low:
At I
on/off
= 1.0 mA
At V
on/off
= 0.0 V
Logic High:
At I
on/off
= 0.0 µA
Leakage Current
Turn-on Time (See Figure 10.)
(I
O
= 80% of I
O, max
; V
O
within ±1% of steady state)
Output Voltage Adjustment:
Output Voltage Remote-sense Range
Output Voltage Set-point Adjustment Range (trim)
Output Overvoltage Protection
Overtemperature Protection
* These are manufacturing test limits. In some situations, results may differ.
Symbol
Min
Typ
Max
Unit
V
on/off
I
on/off
V
on/off
I
on/off
—
0
—
—
—
—
—
—
—
—
40
1.2
1.0
15
50
80
V
mA
V
µA
ms
—
—
V
O, sd
T
C
—
60
5.9*
—
—
—
—
105
0.5
110
7.0*
—
V
%V
O, nom
V
°C
Solder, Cleaning, and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to the electrical board testing. The
result of inadequate circuit-board cleaning and drying can affect both the reliability of a power module and the test-
ability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning, and drying proce-
dures, refer to the
Board-Mounted Power Modules: Soldering and Cleaning
Application Note (AP97-021EPS).
4
Lineage Power
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
