HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
ages should not be broken until time of use. Once the origi-
nal package is broken, the floor life of the product at
conditions of < 30°C and 60% relative humidity varies accord-
ing to the MSL rating (see J-STD-033A). The shelf life for dry
packed SMT packages will be a minimum of 12 months from
the bag seal date, when stored at the following conditions: <
300
250
200
150
100
50
Peak Temp 235 o
C
40° C, < 90% relative humidity.
Cooling
zone
Heat zone
max 4oCs-1
Post Solder Cleaning and Drying Considerations
o
1-4Cs-1
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Lineage
Power Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
Soak zone
30-240s
Tlim above
205oC
Preheat zone
max 4oCs-1
0
REFLOW TIME (S)
Per J-STD-020 Rev. C
300
Figure 51. Recommended Reflow profile.
Peak Temp
250
Cooling
240
235
230
225
220
215
210
205
200
Zone
200
* Min. Time
Above 235°C
150
Heating
Zone
*Time Above
217°C
100
50
0
Reflow Time (Seconds)
Figure 53. Recommended linear reflow profile using Sn/
Ag/Cu solder.
0
10
20
30
TIME (S)
40
50
60
Solder Ball and Cleanliness Requirements
Figure 52. Time Limit curve above 2050C.
Lead Free Soldering
The open frame (no case or potting) power module will meet
the solder ball requirements per J-STD-001B. These require-
ments state that solder balls must neither be loose nor violate
the power module minimum electrical spacing.
The cleanliness designator of the open frame power module
is C00 (per J specification).
The -Z version SMT modules of the HW/HC series are lead-
free (Pb-free) and RoHS compliant and are compatible in a
Pb-free soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to the
modules and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/
Reflow Sensitivity Classification for Nonhermetic Solid State
Surface Mount Devices) for both Pb-free solder profiles and
MSL classification procedures. This standard provides a rec-
ommended forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The sug-
gested Pb-free solder paste is Sn/Ag/Cu (SAC). The recom-
mended linear reflow profile using Sn/Ag/Cu solder is shown
in Figure. 53.
MSL Rating
The HW series SMT modules have a MSL rating of 1.
Storage and Handling
The recommended storage environment and handling proce-
dures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed pack-
Lineage Power
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