HW006/010/012 Series Power Modules; dc-dc Converters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Data Sheet
June 26, 2009
Recommended Pad Layout for Surface-Mount Module
and Recommended Hole Layout for Through-Hole Module
Component-side footprint.
Dimensions are in millimeters and (inches), unless otherwise noted.
29.46 (1.160)
27.84 (1.096)
20.73 (0.816)
KEEP-OUT AREA:
Besides trace to ON/OFF pin,
do not route other traces on the
PWB top layer closest to the
power module in this keep-out area.
1.68 (0.066)
0 (0)
0 (0)
NOTES:
1. FOR CGA SURFACE MOUNT PIN
USE THE FOLLOWING PAD
0.022" DIA VIA
0.032" DIA SOLDER MASK OPENING
4 PLACES FOR OUTPUT PINS
2 PLACES FOR INPUT PINS
0.025" SPACING VIA TO PAD
0.015" MIN SOLDER MASK WALL
0.105" PASTE MASK OPENING
0.110" SOLDER MASK OPENING
Lineage Power
22
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
