欢迎访问ic37.com |
会员登录 免费注册
发布采购

HW004A0A1Z 参数 Datasheet PDF下载

HW004A0A1Z图片预览
型号: HW004A0A1Z
PDF下载: 下载PDF文件 查看货源
内容描述: 18-36VDC和36-75VDC输入; 1.0V - 5V直流输出; 4A - 6A的输出电流 [18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current]
分类和应用:
文件页数/大小: 28 页 / 641 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
 浏览型号HW004A0A1Z的Datasheet PDF文件第15页浏览型号HW004A0A1Z的Datasheet PDF文件第16页浏览型号HW004A0A1Z的Datasheet PDF文件第17页浏览型号HW004A0A1Z的Datasheet PDF文件第18页浏览型号HW004A0A1Z的Datasheet PDF文件第20页浏览型号HW004A0A1Z的Datasheet PDF文件第21页浏览型号HW004A0A1Z的Datasheet PDF文件第22页浏览型号HW004A0A1Z的Datasheet PDF文件第23页  
Data Sheet  
HW/HC004/005/006 Series DC-DC Power Module:  
May 16, 2008  
18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current  
Thermal Considerations  
C5 56nF  
L2  
The power modules operate in a variety of thermal  
environments; however, sufficient cooling should be  
provided to help ensure reliable operation.  
10uH  
Vin+  
Vout+  
C4  
33uF  
100V  
HW005  
Considerations include ambient temperature, airflow,  
module power dissipation, and the need for increased  
reliability. A reduction in the operating temperature of the  
module will result in an increase in reliability. The  
thermal data presented here is based on physical  
measurements taken in a wind tunnel.  
C1  
0.68uF  
C2  
0.68uF  
C3  
0.68uF  
Vin-  
Vout-  
L1 - CMC  
Pulse P0354  
C6 56nF  
The thermal reference point, Tref used in the  
specifications is shown in Figure 66. For reliable  
Figure 67. Suggested Configuration for EN55022  
Class B.  
operation this temperature should not exceed 115 oC.  
90  
80  
70  
60  
EN 55022 Class B Conducted Average dBuV  
50  
40  
30  
20  
10  
100K  
Frequency(Hz)  
500K  
1M  
5M  
10M  
30M  
Figure 66. Tref Temperature Measurement Location.  
Figure 68. EMC signature using above filter,  
HW005A0F.  
Please refer to the Application Note “Thermal  
Characterization Process For Open-Frame Board-  
Mounted Power Modules” for a detailed discussion of  
thermal aspects including maximum device  
temperatures.  
For further information on designing for EMC  
compliance, please refer to the FLTR100V10 data sheet  
(FDS01-043EPS).  
Layout Considerations  
The HW/HC005 power module series are low profile in  
order to be used in fine pitch system card architectures.  
As such, component clearance between the bottom of  
the power module and the mounting board is limited.  
Avoid placing copper areas on the outer layer directly  
underneath the power module. Also avoid placing via  
interconnects underneath the power module.  
Heat Transfer via Convection  
Increased airflow over the module enhances the heat  
transfer via convection. Derating figures showing the  
maximum output current that can be delivered by each  
module versus local ambient temperature (TA) for natural  
convection and up to 3m/s (600 ft./min) are shown in the  
respective Characteristics Curves section.  
For additional layout guide-lines, refer to FLTR100V10  
data sheet.  
EMC Considerations  
The figure 67 shows a suggested configuration to meet  
the conducted emission limits of EN55022 Class B.  
LINEAGE POWER  
19  
 复制成功!