欢迎访问ic37.com |
会员登录 免费注册
发布采购

HC006A6A1Z 参数 Datasheet PDF下载

HC006A6A1Z图片预览
型号: HC006A6A1Z
PDF下载: 下载PDF文件 查看货源
内容描述: 18-36VDC输入; 3.3V和5V直流输出; 6.6A - 10A输出电流 [18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current]
分类和应用:
文件页数/大小: 19 页 / 515 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
 浏览型号HC006A6A1Z的Datasheet PDF文件第7页浏览型号HC006A6A1Z的Datasheet PDF文件第8页浏览型号HC006A6A1Z的Datasheet PDF文件第9页浏览型号HC006A6A1Z的Datasheet PDF文件第10页浏览型号HC006A6A1Z的Datasheet PDF文件第12页浏览型号HC006A6A1Z的Datasheet PDF文件第13页浏览型号HC006A6A1Z的Datasheet PDF文件第14页浏览型号HC006A6A1Z的Datasheet PDF文件第15页  
Data Sheet  
HC006/010 Series DC-DC Power Module:  
May 16, 2008  
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current  
Thermal Considerations  
The power modules operate in a variety of thermal  
environments; however, sufficient cooling should be  
provided to help ensure reliable operation.  
Considerations include ambient temperature, airflow,  
module power dissipation, and the need for increased  
reliability. A reduction in the operating temperature of the  
module will result in an increase in reliability. The  
thermal data presented here is based on physical  
measurements taken in a wind tunnel.  
The thermal reference point, Tref used in the  
specifications is shown in Figure 18. For reliable  
operation this temperature should not exceed 110 oC  
Figure 19. Suggested Configuration for EN55022  
Class B.  
For further information on designing for EMC  
compliance, please refer to the FLTR100V10 data sheet  
(FDS01-043EPS).  
Layout Considerations  
The HC power module series are low profile in order to  
be used in fine pitch system card architectures. As  
such, component clearance between the bottom of the  
power module and the mounting board is limited. Avoid  
placing copper areas on the outer layer directly  
underneath the power module. Also avoid placing via  
interconnects underneath the power module.  
Tref  
Airflow  
Figure 18. Tref Temperature Measurement Location.  
For additional layout guide-lines, refer to FLTR100V10  
data sheet.  
Please refer to the Application Note “Thermal  
Characterization Process For Open-Frame Board-  
Mounted Power Modules” for a detailed discussion of  
thermal aspects including maximum device  
temperatures.  
Heat Transfer via Convection  
Increased airflow over the module enhances the heat  
transfer via convection. Derating figures showing the  
maximum output current that can be delivered by each  
module versus local ambient temperature (TA) for natural  
convection and up to 3m/s (600 ft./min) are shown in the  
respective Characteristics Curves section.  
EMC Considerations  
The figure 19 shows a suggested configuration to meet  
the conducted emission limits of EN55022 Class B.  
LINEAGE POWER  
11