Data Sheet
HW/HC004/005/006 Series DC-DC Power Module:
May 16, 2008
18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
damage to the modules, and can adversely affect
long-term reliability.
Surface Mount Information (continued)
The surface mountable modules in the HW005 family
use our newest SMT technology called “Column Pin”
(CP) connectors. Fig 71 shows the new CP connector
before and after reflow soldering onto the end-board
assembly.
24.2
COG
HW005 Board
Insulator
19.0
9.5
Solder Ball
End assembly PCB
Note: All dimensions in mm.
Figure 70. Pick and Place Location.
Figure 71. Column Pin Connector Before and After
Reflow Soldering.
Z Plane Height
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder. The CP connector design is
able to compensate for large amounts of co-planarity
and still ensure a reliable SMT solder joint.
The ‘Z’ plane height of the pick and place location is
7.50mm nominal with an RSS tolerance of +/-0.25
mm.
Nozzle Recommendations
Typically, the eutectic solder melts at 183oC, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable solder joint. There
are several types of SMT reflow technologies
currently used in the industry. These surface mount
power modules can be reliably soldered using natural
forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering
the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.
The module weight has been kept to a minimum by
using open frame construction. Even so, they have a
relatively large mass when compared with
conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
300
Peak Temp 235oC
For further information please contact your local
Lineage Power Technical Sales Representative.
250
Cooling
zone
1- 4 oCs-1
Heat zone
max 4oCs-1
200
150
10 0
50
Reflow Soldering Information
The HW005 family of power modules is available for
either Through-Hole (TH) or Surface Mount (SMT)
soldering. These power modules are large mass, low
thermal resistance devices and typically heat up
slower than other SMT components. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly.
Soak zone
30-240s
T
lim above
205oC
Preheat zone
max 4oCs-1
0
REFLOW TIME (S)
The following instructions must be observed when
SMT soldering these units. Failure to observe these
instructions may result in the failure of or cause
Figure 72. Recommended Reflow Profile
LINEAGE POWER
25
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
