FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Data Sheet
March 2008
Post Solder Cleaning and Drying Consid-
eratrions
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing.The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the testability
of the finished circuit-board assembly.For guidance on
appropriate soldering,cleaning and drying proce-
dures,refer to Lineage Power Board Mounted Power
Modules:Soldering and Cleaning Application Note.
Through-Hole Lead Free Soldering Infor-
mation
The RoHS-compliant through-Hole products use the
SAC(Sn/Ag/Cu) Pb-free solder and RoHS- compliant
components.They are designed to be processed
through single or dual wave soldering machines.The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.A
0
Maximum preheat rate 3 C/s is suggested.The wave
preheat process should be such that the temperature
0
of the power module board is kept below 210 C.For Pb
solder,the recommended pot temperature is
0
0
260 C,while the Pb-free solder pot is 270 C max.Not
all RoHS-compliant through-hole products can be pro-
cessed with paste-through-hole Pb or Pb-free reflow
process.If additional information is needed,please con-
sult with your Lineage Power representative for more
details.
12
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