Data Sheet
March 26, 2008
FLT007A0/FLT007A0-SR Input Filter Modules
75Vdc Input Voltage Maximum, 7A Output Current Maximum
300
Pb-free Reflow Profile
P eak Temp
235
o
C
Co o ling
zo ne
1
o
Cs
-1
-4
250
REFLOW TEMP (°C)
200
Heat zo ne
max 4
o
Cs
-1
150
100
So ak zo ne
30-240s
P reheat zo ne
max 4
o
Cs
-1
T
lim
above
205
o
C
50
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 15.
0
MSL Rating
REFLOW TIME (S)
Figure 13. Reflow Profile for Tin/Lead (Sn/Pb)
process.
240
235
The FLT007A0-SR SMT modules have a MSL rating
of 1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of <= 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
300
MAX TEMP SOLDER (°C)
230
225
220
215
210
205
200
0
10
20
30
40
50
60
Figure 14. Time Limit Curve Above 205 C Reflow
for Tin Lead (Sn/Pb) process.
o
Lead Free Soldering
The FLT007A0-SR SMT modules are lead-free (Pb-
free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
Per J-STD-020 Rev. C
Peak Temp 260°C
250
Cooling
Zone
Reflow Temp (°C)
200
* Min. Time Above 235°C
15 Seconds
Heating Zone
1°C/Second
*Time Above 217°C
60 Seconds
150
100
50
0
Reflow Time (Seconds)
Figure 15. Recommended linear reflow profile
using Sn/Ag/Cu solder.
LINEAGE
POWER
9
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
