Data Sheet
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
October 11, 2011
Surface Mount Information
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Pick and Place
The ESTW025A0F modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
300
Peak Temp 235oC
250
Cooling
zone
Heat zone
max 4oCs-1
200
150
10 0
50
1- 4 oCs-1
Soak zone
30-240s
T
lim above
205oC
Preheat zone
max4oCs-1
0
Figure 18. Pick and Place Location.
Nozzle Recommendations
REFLOW TIME (S)
Figure 19. Reflow Profile for Tin/Lead (Sn/Pb)
process.
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
240
235
230
225
220
215
210
205
200
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
0
10
20
30
40
50
60
Figure 20. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process
The ESTW025A0F power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
Lead Free Soldering
The –Z version of the ESTW025A0F modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
Reflow Soldering Information
The surface mountable modules in the
ESTW025A0F-S family use our newest SMT
LINEAGE POWER
10
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
