Data Sheet
ESTW004A2C Series DC-DC Converter Power Modules
36–75Vdc Input; 15.0Vdc/4.2Adc Output
August 30, 2011
Sn/Ag/Cu solder is shown in Figure 23.
Surface Mount Information (continued)
300
250
200
150
100
50
Per J-STD-020 Rev. C
300
Peak Temp 260°C
Peak Temp 235oC
250
Cooling
Zone
Cooling
zone
1- 4 oCs-1
* Min. Time Above 235°C
Heat zone
max4oCs-1
200
15 Seconds
Heating Zone
1°C/Second
*Time Above 217°C
60 Seconds
150
10 0
50
Soak zone
30-240s
T
lim above
205oC
0
Preheat zone
max4oCs-1
Reflow Time (Seconds)
Figure 22. Recommended linear reflow profile
using Sn/Ag/Cu solder.
0
REFLOW TIME (S)
Figure 20. Reflow Profile for Tin/Lead (Sn/Pb)
process
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
240
235
230
225
220
215
210
205
200
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
0
10
20
30
40
50
60
Figure 21. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have a RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is
270C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
MSL Rating
The ESTW004A2C modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
LINEAGE POWER
11
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
