Data Sheet
GE
ESTW015A0A Barracuda™ Series; DC-DC Converter Power Modules
36-75Vdc Input; 5.0Vdc, 15A, 75W Output
Surface Mount Information (continued)
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture barrier bags (MBB) with
desiccant are provided for the ESTW015A0Axx-SZ modules.
These sealed packages should not be broken until time of
use. Once the original package is broken, the floor life of the
product at conditions of 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A). The
shelf life for dry packed SMT packages is a minimum of 12
months from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity.
Figure 18. Cold Wall Mounting
Pick and Place
The ESTW015A0A modules use an open frame construction
and are designed for a fully automated assembly process.
The modules are fitted with a label designed to provide a
large surface area for pick and place operations. The label
meets all the requirements for surface mount processing, as
well as safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries product
information such as product code, serial number and the
location of manufacture.
COLDPLATE TEMEPERATURE, TC (oC)
Figure 19. Derated Output Current versus Cold Wall
Temperature with local ambient temperature around
module at 85C; VIN =48V.
Through-Hole Soldering Information
Lead-Free Soldering
The ESTW015A0Axx RoHS-compliant through-hole products
use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have a
RoHS-compliant finish that is compatible with both Pb and
Pb-free wave soldering processes. A maximum preheat rate
of 3C/s is suggested. The wave preheat process should be
such that the temperature of the power module board is
kept below 210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is 270C
max.
Figure 20. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be
considered to optimize this process. The minimum
recommended nozzle diameter for reliable operation is
6mm. The maximum nozzle outer diameter, which will safely
fit within the allowable component spacing, is 9 mm.
Paste-in-Hole Soldering
The ESTW015A0Axx module is compatible with reflow paste-
in-hole soldering processes shown in Figures 25-27. Since
the ESTW015A0AxxZ module is not packaged per J-STD-033
Rev.A, the module must be baked prior to the paste-in-hole
reflow process. ESTW015A0Axx-HZ modules are not
compatible with paste-in-hole reflow soldering. Please
contact your GE Sales Representative for further
information.
Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.
Surface Mount Information
MSL Rating
The ESTW015A0A-SZ module has a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages
is detailed in J-STD-033 Rev. A (Handling,
March 28, 2013
©2012 General Electric Company. All rights reserved.
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