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EHW015A0A1 参数 Datasheet PDF下载

EHW015A0A1图片预览
型号: EHW015A0A1
PDF下载: 下载PDF文件 查看货源
内容描述: 36-75VDC输入; 5.0VDC输出; 15A输出电流 [36-75Vdc Input; 5.0Vdc Output; 15A Output Current]
分类和应用:
文件页数/大小: 19 页 / 1081 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
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Data Sheet  
EHW015A0A Series Eighth-Brick Power Modules  
36–75Vdc Input; 5.0Vdc Output; 15A Output Current  
June 29, 2009  
Surface Mount Information (continued)  
Through-Hole Lead-Free Soldering  
Information  
broken, the floor life of the product at conditions of ≤  
30°C and 60% relative humidity varies according to the  
MSL rating (see J-STD-033A). The shelf life for dry  
packed SMT packages will be a minimum of 12 months  
from the bag seal date, when stored at the following  
conditions: < 40° C, < 90% relative humidity.  
The RoHS-compliant through-hole products use the  
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant  
components. They are designed to be processed  
through single or dual wave soldering machines. The  
pins have an RoHS-compliant finish that is compatible  
with both Pb and Pb-free wave soldering processes. A  
maximum preheat rate of 3°C/s is suggested. The  
wave preheat process should be such that the  
temperature of the power module board is kept below  
210°C. For Pb solder, the recommended pot  
temperature is 260°C, while the Pb-free solder pot is  
270°C max. Not all RoHS-compliant through-hole  
products can be processed with paste-through-hole Pb  
or Pb-free reflow process. If additional information is  
needed, please consult with your Lineage Power  
representative for more details.  
Post Solder Cleaning and Drying  
Considerations  
Post solder cleaning is usually the final circuit-board  
assembly process prior to electrical board testing. The  
result of inadequate cleaning and drying can affect both  
the reliability of a power module and the testability of  
the finished circuit-board assembly. For guidance on  
appropriate soldering, cleaning and drying procedures,  
refer to Lineage Power Board  
Mounted Power Modules: Soldering and Cleaning  
Application Note (AN04-001).  
300  
Per J-STD-020 Rev. C  
Peak Temp 260°C  
250  
Cooling  
200  
Zone  
* Min. Time Above 235°C  
15 Seconds  
150  
Heating Zone  
1°C/Second  
*Time Above 217°C  
60 Seconds  
100  
50  
0
Reflow Time (Seconds)  
Figure 27. Recommended linear reflow profile using  
Sn/Ag/Cu solder.  
LINEAGE POWER  
12