Data Sheet
June 27, 2012
EBVW025A0B Series Power Modules; DC-DC Converters
36-75Vdc Input; 12Vdc Output; 25A Output Current
recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Figure 23.
Layout Considerations
The EBVW025 power module series are low profile in order
to be used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the
power module. Also avoid placing via interconnects
underneath the power module.
For additional layout guide-lines, refer to FLT007A0Z Data
Sheet.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant, Z version, through-hole products use
the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. The non-Z version products use lead-tin
(Pb/Sn) solder and RoHS-compliant components. Both
version modules are designed to be processed through
single or dual wave soldering machines. The pins have an
RoHS-compliant, pure tin finish that is compatible with both
Pb and Pb-free wave soldering processes. A maximum
preheat rate of 3C/s is suggested. The wave preheat
process should be such that the temperature of the power
module board is kept below 210C. For Pb solder, the
recommended pot temperature is 260C, while the Pb-free
solder pot is 270C max. Not all RoHS-compliant through-
hole products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information is
needed, please consult with your Lineage Power
Figure 23. Recommended linear reflow profile using
Sn/Ag/Cu solder.
MSL Rating
The EBVW025A0BA modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages
is detailed in J-STD-033 Rev. A (Handling, Packing,
Shipping and Use of Moisture/Reflow Sensitive Surface
Mount Devices). Moisture barrier bags (MBB) with
desiccant are required for MSL ratings of 2 or greater.
These sealed packages should not be broken until time of
use. Once the original package is broken, the floor life of
the product at conditions of 30°C and 60% relative
humidity varies according to the MSL rating (see J-STD-
025A). The shelf life for dry packed SMT packages will be
a minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90% relative
humidity.
representative for more details.
Reflow Lead-Free Soldering Information
The RoHS-compliant through-hole products can be
processed with the following paste-through-hole Pb or Pb-
free reflow process.
Max. sustain temperature :
245C (J-STD-020C Table 4-2: Packaging
Thickness>=2.5mm / Volume > 2000mm3),
Peak temperature over 245C is not suggested due to the
potential reliability risk of components under continuous
high-temperature.
Min. sustain duration above 217C : 90 seconds
Min. sustain duration above 180C : 150 seconds
Max. heat up rate: 3C/sec
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Lineage Power Board Mounted Power Modules:
Soldering and Cleaning Application Note (AP01-056EPS).
Max. cool down rate: 4C/sec
In compliance with JEDEC J-STD-020C spec for 2 times
reflow requirement.
Pb-free Reflow Profile
EMC Considerations
BMP module will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification
The circuit and plots in Figure 24 shows a suggested
configuration to meet the conducted emission limits of
EN55022 Class B. For further information on designing for
EMC compliance, please refer to the FLT007A0 data sheet.
procedures. BMP will comply with JEDEC J-STD-020C
specification for 3 times reflow requirement. The suggested
Pb-free solder paste is Sn/Ag/Cu (SAC). The
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