Data Sheet
GE
EBDW020A0B Barracuda™ Series; DC-DC Converter Power Modules
36-75Vdc Input; 12.0Vdc, 20.0A, 240W Output
Please refer to the Application Note “Thermal Characterization
Thermal Considerations (continued)
Process For Open-Frame Board-Mounted Power Modules” for
temperature, as defined in IPC-9592. This procedure is then
a detailed discussion of thermal aspects including maximum
repeated for a different airflow or ambient temperature until a
device temperatures.
family of module output derating curves is obtained.
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer
via convection. The thermal derating of figure 21-23 shows
the maximum output current that can be delivered by each
module in the indicated orientation without exceeding the
maximum THx temperature versus local ambient temperature
(TA) for several air flow conditions.
The use of Figure 21 is shown in the following example:
Example
What is the minimum airflow necessary for a EBDW020A0B
operating at VI = 48 V, an output current of 15A, and a
maximum ambient temperature of 60 °C in transverse
orientation.
Solution:
Velocity = 0.5m/s (100 LFM) or greater.
Given: Vin= 48V, IO = 14A, TA = 60 °C
Determine required airflow velocity (Use Figure 21):
Velocity = 0.5m/s (100 LFM) or greater.
Heat-dissipating components are mounted on the top side of
the module. Heat is removed by conduction, convection and
radiation to the surrounding environment. Proper cooling can
be verified by measuring the thermal reference temperature
(TH1 or TH2). Peak temperature occurs at the position indicated
in Figure 19 and 20. For reliable operation this temperature
should not exceed TH1=125°C or TH2=105°C. For extremely
high reliability you can limit this temperature to a lower value.
LOCAL AMBIENT TEMPERATURE, TA (C)
Figure 21. Output Current Derating for the Open Frame
EBDW020A0B in the Transverse Orientation; Airflow
Direction from Vin(-) to Vin(+); Vin = 48V.
Figure 19. Location of the thermal reference temperature TH. Do
not exceed 113 °C.
Figure 20. Location of the thermal reference temperature
TH3 for Baseplate module. Do not exceed 110 °C.
The output power of the module should not exceed the rated
power for the module as listed in the Ordering Information
Figure 22. Output Current Derating for the Base Plate
table.
LOCAL AMBIENT TEMPERATURE, TA (C)
EBDW020A0Bxx-H in the Transverse Orientation; Airflow
Direction from Vin(-) to Vin(+); Vin = 48V.
April 15, 2013
©2012 General Electric Company. All rights reserved.
Page 12
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