Data Sheet
Austin MiniLynxTM SIP Non-isolated Power Modules:
February 26, 2009
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 3A output current
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3°C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210°C. For Pb
solder, the recommended pot temperature is 260°C,
while the Pb-free solder pot is 270°C max. Not all
RoHS-compliant through-hole products can be
processed with paste-through-hole Pb or Pb-free reflow
process. If additional information is needed, please
consult with your Lineage Power technical
representative for more details.
LINEAGE POWER
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LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
