Data Sheet
12V Austin LynxTM SMT Non-isolated Power Modules Programmable:
10 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 10A output current
April 8, 2008
Surface Mount Information
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
Pick and Place
The 12V Austin Lynx Programmable SMT modules
use an open frame construction and are designed for
a fully automated assembly process. The modules
are fitted with a label designed to provide a large
surface area for pick and place operations. The label
meets all the requirements for surface mount
processing, as well as safety standards, and is able to
withstand reflow temperatures of up to 300oC. The
label also carries product information such as product
code, serial number and the location of manufacture.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
300
Peak Temp 235oC
250
Cooling
zone
Heat zone
max 4oCs-1
200
150
10 0
50
1- 4 oCs-1
Soak zone
30-240s
T
lim above
Figure 33. Pick and Place Location.
Nozzle Recommendations
205oC
Preheat zone
max 4oCs-1
0
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
REFLOW TIME (S)
Figure 34. Reflow Profile for Tin/Lead (Sn/Pb)
process.
240
235
230
225
220
215
210
205
200
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The Austin LynxTM 12 V SMT power modules are lead
free modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
0
10
20
30
40
50
60
Figure 35. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process.
soldering these units. Failure to observe these
LINEAGE POWER
18
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
