Data Sheet
Austin MicroLynxTM 12V SMT Non-isolated Power Modules:
10 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 5A output current
April 1, 2008
Surface Mount Information
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Pick and Place
The Austin MicroLynxTM 12V SMT modules use an
open frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and placing. The label meets all the
requirements for surface mount processing, as well as
safety standards and is able to withstand maximum
reflow temperature. The label also carries product
information such as product code, serial number and
location of manufacture.
300
Peak Temp 235oC
250
Cooling
zone
Heat zone
max 4oCs-1
200
150
10 0
50
1- 4 oCs-1
Soak zone
30-240s
T
lim above
205oC
Figure 33. Pick and Place Location.
Nozzle Recommendations
Preheat zone
max 4oCs-1
0
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended nozzle
diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the
allowable component spacing, is 8 mm max.
REFLOW TIME (S)
Figure 34. Reflow Profile for Tin/Lead (Sn/Pb)
process.
240
235
230
225
220
215
210
205
200
Tin Lead Soldering
The Austin MicroLynxTM 12V SMT power modules are
lead free modules and can be soldered either in a
lead-free solder process or in a conventional Tin/Lead
(Sn/Pb) process. It is recommended that the
customer review data sheets in order to customize the
solder reflow profile for each application board
assembly. The following instructions must be
observed when soldering these units. Failure to
observe these instructions may result in the failure of
or cause damage to the modules, and can adversely
affect long-term reliability.
0
10
20
30
40
50
60
Figure 35. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
LINEAGE POWER
19
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
