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ATH016A0X43 参数 Datasheet PDF下载

ATH016A0X43图片预览
型号: ATH016A0X43
PDF下载: 下载PDF文件 查看货源
内容描述: 2.4 - 5.5V直流输入; 0.75Vdc至3.3VDC输出; 16A的输出电流 [2.4 - 5.5Vdc input; 0.75Vdc to 3.3Vdc Output; 16A output current]
分类和应用:
文件页数/大小: 19 页 / 563 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
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Data Sheet  
Austin SuperlynxTM II SIP Non-isolated Power Modules:  
March 31, 2008  
2.4 – 5.5Vdc input; 0.75Vdc to 3.3Vdc Output; 16A output current  
Thermal Considerations  
Power modules operate in a variety of thermal  
environments; however, sufficient cooling should always  
be provided to help ensure reliable operation.  
25.4_  
(1.0)  
Wind Tunnel  
PWBs  
Considerations include ambient temperature, airflow,  
module power dissipation, and the need for increased  
reliability. A reduction in the operating temperature of the  
module will result in an increase in reliability. The thermal  
data presented here is based on physical measurements  
taken in a wind tunnel. The test set-up is shown in Figure  
34. Note that the airflow is parallel to the long axis of the  
module as shown in figure 33. The derating data applies  
to airflow in either direction of the module’s long axis.  
Po we r Mo d ule  
76.2_  
(3.0)  
x
Probe Location  
for measuring  
airflow and  
ambient  
Airflow  
5.97_  
(0.235)  
temperature  
Air  
flow  
Figure 34. Thermal Test Set-up.  
Top View  
Tref  
Heat Transfer via Convection  
Increased airflow over the module enhances the heat  
transfer via convection. Thermal derating curves showing  
the maximum output current that can be delivered at  
different local ambient temperatures (TA) for airflow  
conditions ranging from natural convection and up to  
2m/s (400 ft./min) are shown in the Characteristics  
Curves section.  
Figure 33. T  
ref  
Temperature measurement location.  
The thermal reference point, Tref used in the  
specifications is shown in Figure 33. For reliable  
operation this temperature should not exceed 115oC.  
The output power of the module should not exceed the  
rated power of the module (Vo,set x Io,max).  
Please refer to the Application Note “Thermal  
Characterization Process For Open-Frame Board-  
Mounted Power Modules” for a detailed discussion of  
thermal aspects including maximum device temperatures.  
LINEAGE POWER  
15  
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