Data Sheet
Austin MicroLynxTM II SMT Non-isolated Power Modules:
June 24, 2008
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Please refer to the Application Note “Thermal
Thermal Considerations
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device temperatures.
Power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The thermal
data presented here is based on physical measurements
taken in a wind tunnel. The test set-up is shown in Figure
33. Note that the airflow is parallel to the long axis of the
module as shown in figure 32. The derating data applies
to airflow in either direction of the module’s long axis.
25.4_
(1.0)
Wind Tunnel
PWBs
Power Module
Air Flow
76.2_
(3.0)
T
ref1 (inductor winding)
x
Probe Location
for measuring
airflow and
7.24_
(0.285)
ambient
temperature
Air
flow
Figure 33. Thermal Test Set-up.
Top View
Heat Transfer via Convection
T
ref2
Increased airflow over the module enhances the heat
transfer via convection. Thermal derating curves
showing the maximum output current that can be
delivered by various module versus local ambient
temperature (TA) for natural convection and up to 1m/s
(200 ft./min) are shown in the Characteristics Curves
section.
Bottom View
Figure 32. T
Temperature measurement location.
ref
The thermal reference point, Tref 1 used in the
specifications of thermal derating curves is shown in
Figure 32. For reliable operation this temperature should
not exceed 125oC.
The output power of the module should not exceed the
rated power of the module (Vo,set x Io,max).
LINEAGE POWER
15