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ATH006A0X 参数 Datasheet PDF下载

ATH006A0X图片预览
型号: ATH006A0X
PDF下载: 下载PDF文件 查看货源
内容描述: 2.4 - 5.5V直流输入; 0.75Vdc到3.63Vdc输出; 6A的输出电流 [2.4 - 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current]
分类和应用:
文件页数/大小: 19 页 / 521 K
品牌: LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
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Data Sheet  
Austin MicroLynxTM II SIP Non-isolated Power Modules:  
June 24, 2008  
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current  
Thermal Considerations  
25.4_  
(1.0)  
Wind Tunnel  
PWBs  
Power modules operate in a variety of thermal  
environments; however, sufficient cooling should be  
provided to help ensure reliable operation.  
Power Module  
Considerations include ambient temperature, airflow,  
module power dissipation, and the need for increased  
reliability. A reduction in the operating temperature of the  
module will result in an increase in reliability. The thermal  
data presented here is based on physical measurements  
taken in a wind tunnel. The test set-up is shown in Figure  
33. Note that the airflow is parallel to the long axis of the  
module as shown in figure 32. The derating data applies  
to airflow in either direction of the module’s long axis.  
76.2_  
(3.0)  
x
Probe Location  
for measuring  
airflow and  
Air Flow  
7.24_  
(0.285)  
ambient  
temperature  
Air  
flow  
Figure 33. Thermal Test Set-up.  
Heat Transfer via Convection  
Increased airflow over the module enhances the heat  
transfer via convection. Thermal derating curves  
showing the maximum output current that can be  
delivered by various module versus local ambient  
temperature (TA) for natural convection and up to 1m/s  
(200 ft./min) are shown in the Characteristics Curves  
section.  
Top View  
Tref  
Bottom View  
Figure 32. T  
Temperature measurement location.  
ref  
The thermal reference point, Tref 1 used in the  
specifications of thermal derating curves is shown in  
Figure 32. For reliable operation this temperature should  
not exceed 125oC.  
The output power of the module should not exceed the  
rated power of the module (Vo,set x Io,max).  
Please refer to the Application Note “Thermal  
Characterization Process For Open-Frame Board-  
Mounted Power Modules” for a detailed discussion of  
thermal aspects including maximum device temperatures.  
LINEAGE POWER  
15  
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