Data Sheet
16V Pico TLynxTM 4A: Non-isolated DC-DC Power Modules
8 – 16Vdc input; 0.6Vdc to 8.0Vdc output; 4A output current
September 13, 2010
Surface Mount Information
MSL Rating
The 16V Pico TLynxTM 4A modules have a MSL
rating of 2.
Pick and Place
The 16V Pico TLynxTM 4A modules use an open
frame construction and are designed for a fully
automated assembly process. The modules are
fitted with a label designed to provide a large
surface area for pick and place operations. The
label meets all the requirements for surface
mount processing, as well as safety standards,
and is able to withstand reflow temperatures of
up to 300oC. The label also carries product
information such as product code, serial number
and the location of manufacture.
Storage and Handling
The recommended storage environment and
handling procedures for moisture-sensitive
surface mount packages is detailed in J-STD-033
Rev. A (Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with
desiccant are required for MSL ratings of 2 or
greater. These sealed packages should not be
broken until time of use. Once the original
package is broken, the floor life of the product at
conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-
033A). The shelf life for dry packed SMT
Nozzle Recommendations
The module weight has been kept to a minimum
by using open frame construction. Variables such
as nozzle size, tip style, vacuum pressure and
placement speed should be considered to
optimize this process. The minimum
recommended inside nozzle diameter for reliable
operation is 3mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 7 mm.
packages will be a minimum of 12 months from
the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity.
300
Per J-STD-020 Rev. C
Peak Temp 260°C
250
Cooling
200
Lead Free Soldering
Zone
* Min. Time Above 235°C
The 16V Pico TLynxTM 4A modules are lead-free
(Pb-free) and RoHS compliant and fully
compatible in a Pb-free soldering process.
Failure to observe the instructions below may
result in the failure of or cause damage to the
modules and can adversely affect long-term
reliability.
15 Seconds
150
Heating Zone
1°C/Second
*Time Above 217°C
60 Seconds
100
50
0
Reflow Time (Seconds)
Pb-free Reflow Profile
Figure 62. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Power Systems will comply with J-STD-020 Rev.
C (Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices)
for both Pb-free solder profiles and MSL
classification procedures. This standard provides
a recommended forced-air-convection reflow
profile based on the volume and thickness of the
package (table 4-2). The suggested Pb-free
solder paste is Sn/Ag/Cu (SAC). The
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final
circuit-board assembly process prior to electrical
board testing. The result of inadequate cleaning
and drying can affect both the reliability of a
power module and the testability of the finished
circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying
procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application
Note (AN04-001).
recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 62. Soldering
outside of the recommended profile requires
testing to verify results and performance.
LINEAGE POWER
24
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
