Data Sheet
12V TLynxTM: Non-isolated DC-DC Power Modules
July 24, 2009
4.5 – 14Vdc input; 0.69Vdc to 5.5Vdc output; 20A output current
not be broken until time of use. Once the original
Surface Mount Information
package is broken, the floor life of the product at
conditions of ≤ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The
shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Pick and Place
The 12V TLynxTM modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and
place operations. The label meets all the requirements
for surface mount processing, as well as safety
standards, and is able to withstand reflow
300
Per J-STD-020 Rev. C
Peak Temp 260°C
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
250
Cooling
200
Zone
* Min. Time Above 235°C
15 Seconds
150
Heating Zone
Nozzle Recommendations
*Time Above 217°C
1°C/Second
60 Seconds
100
50
0
The module weight has been kept to a minimum by
using open frame construction. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended inside nozzle diameter for
reliable operation is 3mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 7 mm.
Reflow Time (Seconds)
Figure 50. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Post Solder Cleaning and Drying
Considerations
Lead Free Soldering
The 12V TLynxTM modules are lead-free (Pb-free) and
RoHS compliant and fully compatible in a Pb-free
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the testability
of the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note (AN04-001).
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Fig. 50. Soldering outside of the
recommended profile requires testing to verify results
and performance.
MSL Rating
The 12V TLynxTM modules have a MSL rating of 2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages should
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