Data Sheet
Pico TLynxTM 6A: Non-isolated DC-DC Power Modules
May 20, 2009
2.4 – 5.5Vdc input; 0.6Vdc to 3.63Vdc output; 6A output current
Sensitive Surface Mount Devices). Moisture barrier
Surface Mount Information
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Pick and Place
The Pico TLynxTM 6A modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
300
Per J-STD-020 Rev. C
Peak Temp 260°C
250
Cooling
200
Nozzle Recommendations
Zone
* Min. Time Above 235°C
15 Seconds
The module weight has been kept to a minimum by
using open frame construction. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended inside nozzle diameter
for reliable operation is 3mm. The maximum nozzle
outer diameter, which will safely fit within the
150
Heating Zone
1°C/Second
*Time Above 217°C
60 Seconds
100
50
0
Reflow Time (Seconds)
allowable component spacing, is 7 mm.
Figure 47. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Lead Free Soldering
The Pico TLynxTM 6A modules are lead-free (Pb-free)
and RoHS compliant and fully compatible in a Pb-free
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AN04-001).
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 47. Soldering
outside of the recommended profile requires testing to
verify results and performance.
MSL Rating
The Pico TLynxTM 6A modules have a MSL rating of
2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
LINEAGE POWER
22
LINEAGEPOWER [ LINEAGE POWER CORPORATION ]
