LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LVY9033/TR2
Soldering Iron:
Basic spec is ≦5 sec when 260℃.If temperature is higher, time should be shorter(+10 ℃→-1sec).
Power dissipation of iron should be smaller than 15W,and temperature should be controllable.
Surface temperature of the device should be under 230 ℃.
Soldering heat
Soldering heat Max. 260℃
245±5℃within 5 sec
Preheat
120 ~ 150℃
120 ~ 180 sec
Reflow Temp/Time
Temp.
(℃)
220
Rising
Cooling
+5℃/sec
-5℃/sec
Preheat
150
120
Time
60 ~ 120 sec
5sec