LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. L9UG9753
Soldering Iron:
Page 4/6
Basic spec is ≦5 sec when 260℃. If temperature is higher, time should be shorter(+10 ℃ → -1sec).
Power dissipation of iron should be smaller than 15W,and temperature should be controllable.
Surface temperature of the device should be under 230 ℃.
Soldering heat
Soldering heat Max. 260℃
245±5℃ within 5 sec
Preheat
120 ~ 150℃
120 ~ 180 sec
Reflow Temp/Time
Temp.
(℃)
220
Rising
Cooling
+5℃/sec
-5℃/sec
Preheat
150
120
Time
60 ~ 120 sec
5sec