ML145170
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
P DIP 16 = EP
PLASTIC PACKAGE
CASE 648-08
-A-
(ML145170EP)
ISSUE R
B
S
F
C
L
-T-
K
M
H
J
G
D 16 PL
SO 16 = -5P
PLASTIC PACKAGE
CASE 751B-05
(ML145170-5P)
(SOG-16)
-A-
ISSUE J
-B-
P 8 PL
G
F
R X 45
K
C
-T-
J
M
D
16 PL
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-
ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. Ò Typica”lparameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
Page 26 of 26
www.lansdale.com
Issue A
LANSDALE [ LANSDALE SEMICONDUCTOR INC. ]
